Multilayer PCB

Multilayer PCB consist of 3 or more circuit layers bonded together by a thickness of insulating material called prepreg. Prepreg is B stage epoxy impregnated fiberglass. Multilayers are generally considered to be the most sophisticated PCB product due to their construction methods and design complexities.

Highlights (4~8 Day QTA sample,10~15 Day Mass production first lot).

Multilayer PCB(4 Layers)	Multilayer PCB(6 Layers)	Multilayer PCB(8 Layers)

Detailed Account of Multilayer PCB

Power Module Material:Ceramic+FR4+Copper base Layer Coverage:4 Layers+Copper base Surface Technique:Immersion Gold Specialty:Ceramic+FR4 Multiply materials copper-clad laminate.

O-E Module Material: Ceramic+FR4 Layer Coverage:6 Layers Thickness:1.0 mm Surface Technique:Gold-plate +finger Specialty:Embedded Orientation.

Embedded Systems Material:FR4 Layer Coverage:8 Layers Thickness:1.6 mm Surface Technique:HAL Line Width/Space:4mils/4mils Solder Mask Colour:Yellow.

DC/DC Power Module Material:Hi-Tg (170℃), FR4 Layer Coverage:10 Layers Thickness:1.6 mm Surface Technique:Immersion Gold Specialty:Copper Weight 105 um Blind-via/Buried-via Larger Current.

Telecommunication base-station Material:FR4 Layer Coverage:8 Layers Thickness:2.0 mm Surface Technique:HAL Line Width/Space:4mils/4mils Specialty:BGA, Impedance Control, Shade Solder.

Data Collect Material:FR4 Layer Coverage:6 Layers Thickness:1.6 mm Surface:Electrolytic Au + Finger Au Weight Of Finger:30 Microinch Solder Mask Colour:blueBlind-via.

Our Manufacturing processes utilise the latest techniques, with a wide range of 'in-house' finishes including Hot Air Solder Level, Roller Tin, Electroless Nickel Gold, Electroplated Gold, Carbon Ink, Peelable Solder Resist. Electrical test is also an 'in-house' facility.

Our reputation for a high quality, responsive, cost effective and punctual service is maintained by modern equipment and by operating fully documented, recognised Quality Management Systems to ISO 9002 and UL approvals. All manufacture of printed circuit boards is subject to Statistical process control methodology.

With competitive pricing structures for Small, medium, and large quantity pre production and production quantities. Lead-times are flexible to your needs and compatible with forward ordering systems, JIT and MRP.