FR-4 Copper clad laminate (CCL)_Wise Industry Co., Limited (DongGuan LIJI Electronic Material CO.,LTD)

1. COMPANY IDENTIFICATION

Company’s Name: DONGGUAN LIJI ELECTRONIC MATERIAL CO.,LTD.

Company’s Address: JIANSHA ZHOU IND ZONE WANJIANG DISTRICT DONGGUAN GUANGDONG CHINA

Company Tel: +86-0769-87076013 Fax: +86-0769-87076017

2. Base

FR-4 copper clad laminated sheet to be consisted of E-glass fabric, impregnated with epoxy resin and clad with electrolytic foil.
It has excellent electric, mechanical and flamer retardant properties and is widely used for PCB with printed circuit on one or both side in microwave ovens, computer, communication apparatus as well as high grade electronic instruments.

3 Appearance requirements

(1) The end face of foil covered board should be tidy without any delamination and crackle;
(2) Any bubble, wrinkle, pin hole, deep nick, pitting and glue spot on the copper foil covered face is not allowed. Any color changing or dirty can be easily removed by density 1.02g/cm3 hydrochloric acid or proper organic solution;
(3) On lamination face, the defects such as bubble, impressed pitting, nick and glue lack and outer impure which retard its use are not allowed.

4 Features

(1) Excellent dimensional stability;

(2) Excellent mechanical processability;

(3) Excellent heat resistance and mechanical properties;

(4) IPC-4101B/21 specification is applicable.

4 Application

Computer, communication, equipment, instrumentation, VCR, television, electronic game machine, and etc.

5 General Properties

Test Item 测试项目	Test Method (IPC-TM-650) 测试方法	Treatment Condition 处理条件	Unit 单位	Specification (IPC-4101B) 指标	Typical Value 典型值
Peel Strength (1 oz.) 铜箔剥离强度	2.4.8	125℃	N/mm	≥0.7	1.70
Peel Strength (1 oz.) 铜箔剥离强度	2.4.8	Float 288℃ / 10 Sec	N/mm	≥1.05	1.50
Thermal stress 热应力	2.4.13.1	Float288℃/unetched	Sec	≥10	60
Thermal stress 热应力	2.4.22.1	A	%	≤1.0	0.21 / 0.39
Flexural Strength 抗弯强度	2.4.4	Warp	N/mm²	≥415	560
Flexural Strength 抗弯强度	2.4.4	Fill	N/mm²	≥345	410
Flammability 燃烧性	UL94	UL94	Rating	UL94 V-0	V-0
Glass Transition (Tg) 玻璃化转变温度	2.4.25	E-2/105（DSC）	℃	≥130	130
Surface Resistivity 表面电阻	2.5.17.1	C-96/35/90	MΩ	≥1.0×10⁴	2.0×10⁶
Volume Resistivity 体积电阻	2.5.17.1	C-96/35/90	MΩ.cm	≥1.0×10⁶	2.0×10⁸
Dielectric Constant 介电常数	2.5.5.2	Etched/@1 MHZ	—	≤5.4	4.6
Loss Tangent 介质损耗	2.5.5.2	Etched/@1 MHZ	—	≤0.035	0.022
Arc Resistance 耐电弧性	2.5.1	D-48/50+D-0.5/23	Sec	≥60	125
Moisture Absorption 吸水率	2.6.2.1	D-24/23	%	≤0.35 (min0.51mm)	0.20
Moisture Absorption 吸水率	2.6.2.1	D-24/23	%	≤0.80 (max0.51mm)	0.10
Z-Axis Expansion Z-轴热膨胀系数	2.4.24	E-2/105 TMA	ppm/℃	—	58/286
Comparative Tracking Index 相比漏电起痕指数	IEC60112	Etched / 0.1% NH4CL	V	AABUS	175 / 250

Remarks: Specimen Thickness:1.6mm 1/1 样品厚度：1.6mm 1/1

A = Keep the specimen originally without any process 保持原样,不作处理

C = Temperature and humidity conditioning在恒温恒湿的空气中处理

D = Immersing in distilled water with temperature control. 浸在恒温的水中处理

E = Temperature conditioning在恒温的空气中处理

6 Purchasing Information

Base Color

基板颜色

Thickness

厚度

Copper Cladding

铜箔厚度

Regular Size（mm）

常规尺寸

CTI Value

CTI值

自然色 nature (white)

黑色 black

0.05mm ~ 3.5mm

12μm, 18μm,

35μm, 70μm, 105μm

600*1020mm （24" * 40"）

1020*1220mm （40" * 48"）

175 / 250

7 Sample Pictures

General Appearance CCL Layer Info

CCL Laminates Stock Flexible CCL