| AI PCB Manufacturing Capacity Workmanship | |||||||||
| 类别Type | 项目Items | 加工能力Processing capacity | |||||||
| 板材Laminate | 表面处理工艺 (Surface finish) | OSP、化学沉银、化学沉金、喷纯锡、喷铅锡(OSP、Immersion Ag ,ENIG ,HAL-LF,HAL) | |||||||
| 板材类型(Laminate type) | 铝基、铁基、铜基(Aluminum,iron and copper isolation base) | ||||||||
| 常规板材尺寸(Dimension) | 500*600MM 457*610MM | ||||||||
| 常规板材厚度(Scale of board thickness) | 0.6MM、0.8MM、1.0MM、1.2MM、1.6MM、2.0MM、2.5MM、3.0MM | ||||||||
| 板厚铜箔厚度(copper foil) | 0.5-10 OZ | ||||||||
| 板材厚度公差(tolerance of board Thickness) | ±0.1MM | ||||||||
| 介质层厚度(Dielectric thickness) | 0.075-0.15MM | ||||||||
| 铝基厚度(Thickness of Aluminum laminate) | 0.5-3.2MM | ||||||||
| 层次 | 1-4 Layers | ||||||||
| 线路 | 最小线宽(Min trace width) | 5MIL | |||||||
| 最小间距(Min trace space) | 5MIL | ||||||||
| 线宽线距公差(Tolerance of trace width/space) | ±15% | ||||||||
| 铜厚 | 内、外层铜厚(Internal and external) | 0.5-10 OZ | |||||||
| 孔径 | 钻孔孔径(Drilling hole size) | 0.6-6.0 MM | |||||||
| 成品孔径(Finished hole size) | 0.6-6.0 MM | ||||||||
| 孔径公差(Hole tolerance) | ±0.075 MM | ||||||||
| 孔位公差(Tolerance of hole position) | ±0.1 MM | ||||||||
| 板厚孔径比(Aspect ratio) | 5 ：1 | ||||||||
| 阻焊 | 最小阻焊桥(Min solder bridge) | 4 MIL | |||||||
| 尺寸 | 外型尺寸公差(Tolerance of outline dimension) | ±0.1 MM | |||||||
| 最大生产尺寸(Max dimension) | 长方向：1200MM，短方向：300MM (Length:1200MM,Width:300MM) | ||||||||
| 阻抗 | 阻抗公差(Impedance tolerance) | ±10% | |||||||
|
导热系数(Heat conduction modulus) |
低导热 1.0-1.5(Low heat conduction 1.0-1.5) | ||||||||
| 中导热 1.5-1.8(Middle heat conduction 1.5-1.8) | |||||||||
| 高导热 2.0-3.0(High heat conduction 2.0-3.0) | |||||||||
| 抗剥离强度(Peel strength) | ≥ 1.8 N/MM | ||||||||
| 表面电阻率(Surface resistance) | ≥ 1*105 M | ||||||||
| 体积电阻率(Volume resistrivity) | ≥ 1*106 M | ||||||||
| 击穿电压(Breakdown voltag) | ≥ 2 KV/MM | ||||||||
|
耐腐焊性(Solder fioat) |
260℃,10Min 不起泡，不分层(260℃,10Min ,No layerig,No sparkling) | ||||||||
| 介电常数(Permittivity) | ≤ 4.4 | ||||||||
| 介质损耗因子(Disspation factor) | ≤ 0.03 | ||||||||
| 生产能力 Production capacity | |||||||||
| 每月铝基板产量：20000M2，日产铝基板：800M2. | |||||||||
| Monthly yield of AI PCB:20000M2,Daily yield:800M2. | |||||||||
| 交货周期 Lead Time | |||||||||
| 普通样板2-3天，加急样板：24小时，批量：5-8天. | |||||||||
| Ordinary sample:2-3 days,Prompt sampling :24 Hours,Lot production:5-8 days. | |||||||||