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PCB electroplating copper surface coarse reason analysis

Date:2010-11-28 16:21 Source:未知 Author:wilin Click:Times
PCB electroplating copper surface coarse reason analysis
1, copper and copper surface treatment before a dirt poor
2, except for oil pollution
Three, micro inhibitor copper content on the high side or acid content is low
4, former Baptist copper copper content high or pollution acid trough
5, copper cylinder anode phosphorus content inappropriate;
6, anode born membrane is poor
7, anode slime overmuch;
8, anode bag burst
9, anode part conductive adverse
10, air mixing air too dirty, dust or pollution;
11, bath temperature was too high
12, cathodic current density is too large
13, bath organic pollution too much, current density range decline
14, filtering system is bad
15, electroplating splint is poor
16, jig conductive adverse
17, plus board free pinch phenomenon when
18, light agent content inadequate
19, acid than 2 high copper than
20, high acid content
21, copper content is low
22, anode passivation,
23, current ask, rectifier corrugated coefficient is too large
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